This paper introduces the preparation process of high thermal conductivity aluminum alloy forgings, and discusses its application in the field of electronic radiator. Firstly, the research background and significance of high thermal conductivity aluminum alloy forgings are summarized, then the preparation process and key technologies are described in detail, and then the advantages and applications of high thermal conductivity aluminum alloy forgings in electronic radiators are demonstrated by examples. Finally, the main viewpoints and future prospects of this paper are summarized.
With the rapid development of electronic equipment, the heat dissipation problem has become a key factor restricting its performance improvement. Traditional heat sink materials, such as copper and aluminum, although they have certain thermal conductivity, have been unable to meet the needs of high-performance electronic devices. Therefore, the development of aluminum alloy forgings with high thermal conductivity has become an effective way to solve the problem of heat dissipation. This paper focuses on the preparation process of high thermal conductivity aluminum alloy forgings and its application in electronic heat sinks.
Preparation technology of high thermal conductivity aluminum alloy forgings
Alloy design: By optimizing the alloy composition, adding high thermal conductivity elements (such as copper, zinc, etc.), improve the thermal conductivity of aluminum alloy. At the same time, it is necessary to ensure that the alloy has good machining and mechanical properties.
Melting and casting: The use of advanced melting equipment and technology to ensure that the alloy composition is uniform and pure. Through precision casting technology, aluminum alloy ingot with excellent structure was obtained.
Forging and heat treatment: forging of aluminum alloy ingot to further improve its density and mechanical properties. Through appropriate heat treatment process, such as solution treatment, aging treatment, etc., to optimize the microstructure of aluminum alloy, improve its thermal conductivity.
Application of high thermal conductivity aluminum alloy forgings in electronic radiators
Advantages: High thermal conductivity aluminum alloy forgings have excellent thermal conductivity, good processing performance and low cost. Compared with traditional copper radiators, high thermal conductivity aluminum alloy forgings have lower weight and higher thermal conductivity efficiency.
Application example: In the fields of high-performance computers, servers, communication equipment, etc., high thermal conductivity aluminum alloy forgings have been widely used in the manufacture of heat sinks. For example, the CPU heat sink made of high thermal conductivity aluminum alloy forgings can effectively reduce the chip temperature and improve the stability and reliability of the computer. In addition, high thermal conductivity aluminum alloy forgings can also be applied to the manufacture of radiators in new energy vehicles, aerospace and other fields to meet higher levels of heat dissipation needs.
With the continuous development of science and technology, high-performance electronic equipment will have higher and higher requirements for heat sinks. As a material with excellent thermal conductivity and good processing properties, high thermal conductivity aluminum alloy forgings will play a greater role in the field of electronic heat sinks. In the future, the alloy design, preparation process and performance control of high thermal conductivity aluminum alloy can be further optimized to achieve higher thermal conductivity and expand a wider range of applications. At the same time, through the development of new heat dissipation structures and technologies, further improve the heat dissipation efficiency and reliability of electronic equipment, and promote the sustainable development of the electronics industry.
