Electroplating technology and film performance analysis of copper forgings of construction machinery are aimed at the formation and properties of copper forgings during electroplating. Electroplating is a technique for forming a thin film layer on the surface of a metal by controlling plating process parameters and electrolyte formulation.
First of all, electroplating technology needs to choose the appropriate coating material, common chromium plating, nickel plating, galvanized and so on. Secondly, the plating process parameters need to be optimized, including current density, temperature, plating solution composition, PH value, etc. In the plating process, the copper forgings, as the anode, are soaked in the electrolyte, and the metal ions are reduced by the action of impressed current and a metal film is formed.
The analysis of film properties includes the following aspects:
- Coating thickness and uniformity: By measuring and observing the thickness and uniformity of the coating, evaluate the stability and consistency of the plating process.
- Binding force and adhesion: The binding force and adhesion between the coating and the copper matrix, as well as the durability of the coating and the external environment, are evaluated by stretching and stripping tests.
- Corrosion resistance: Through salt spray test, corrosion resistance test and other methods to evaluate the coating’s resistance to corrosive media, to protect the copper matrix from corrosion.
- Tribological properties: evaluate the coefficient of friction, wear rate and other indicators of the coating, as well as the friction characteristics between other materials.
- Surface quality and appearance: Observe and evaluate the surface quality of the coating, such as gloss, color, flatness, etc.
Comprehensive analysis of plating process and film performance can further improve plating technology, optimize film performance, improve corrosion resistance, wear resistance and beauty of copper forgings, extend its service life, and improve product quality and market competitiveness.
